ʻO ke uea keleawe i uhi ʻia i ke kālā, ʻo ia hoʻi ke uea keleawe i uhi ʻia i ke kālā a i ʻole ke uea i uhi ʻia i ke kālā i kekahi mau hihia, he uea lahilahi i huki ʻia e kahi mīkini huki uea ma hope o ke kau ʻana i ke kālā ma luna o ke uea keleawe ʻole oxygen a i ʻole ke uea keleawe haʻahaʻa oxygen. Loaʻa iā ia ka conductivity uila, ka conductivity wela, ke kūpaʻa i ka pala a me ke kūpaʻa i ka oxidation wela kiʻekiʻe.
Hoʻohana nui ʻia ke uea keleawe i uhi ʻia i ke kālā i nā mea uila, kamaʻilio, aerospace, koa a me nā ʻoihana ʻē aʻe e hōʻemi i ke kūpaʻa pili o ka ʻili metala a hoʻomaikaʻi i ka hana kuʻi. Loaʻa i ke kālā ke kūpaʻa kemika kiʻekiʻe, hiki ke pale aku i ka pala o ka alkali a me kekahi mau waikawa organik, ʻaʻole launa pū me ka oxygen i ka lewa maʻamau, a maʻalahi ke hoʻopili ʻia ke kālā a loaʻa iā ia ka hiki ke noʻonoʻo.
Hiki ke hoʻokaʻawale ʻia ke kau ʻana i ke kālā i ʻelua ʻano: ka electroplating kuʻuna a me ka nanometer electroplating. ʻO ke electroplating ke kau ʻana i ka metala i loko o ka electrolyte a waiho i nā ion metala ma luna o ka ʻili o ka hāmeʻa e ke au e hana i kahi ʻili metala. ʻO ke nano-plating ka hoʻoheheʻe ʻana i ka nano-mea i loko o ka solvent kemika, a laila ma o ka hopena kemika, ua waiho ʻia ka nano-mea ma luna o ka ʻili o ka hāmeʻa e hana i kahi ʻili nano-mea.
Pono ka electroplating e hoʻokomo mua i ka mea hana i loko o ka electrolyte no ka hoʻomaʻemaʻe ʻana, a laila ma o ka electrode polarity reversal, ka hoʻoponopono ʻana i ka density current a me nā kaʻina hana ʻē aʻe e kāohi i ka wikiwiki o ka hopena polarization, kāohi i ka helu deposition a me ke ʻano like o ke kiʻiʻoniʻoni, a ma hope loa i ka holoi ʻana, descaling, polishing wire a me nā loulou post-processing ʻē aʻe ma waho o ka laina. Ma ka ʻaoʻao ʻē aʻe, ʻo ka nano-plating ka hoʻohana ʻana i ka hopena kemika e hoʻoheheʻe i ka nano-mea i loko o ka solvent kemika ma ka hoʻomoʻa ʻana, ka hoʻoulu ʻana a i ʻole ka pīpī ʻana, a laila hoʻomoʻa i ka mea hana i loko o ka hopena e kāohi i ka nui o ka hopena, ka manawa hopena a me nā kūlana ʻē aʻe. e uhi i ka nano-mea hana i ka ʻili o ka mea hana, a ma hope loa e hele ma waho o ka pūnaewele ma o nā loulou post-processing e like me ka maloʻo a me ka hoʻoluʻu ʻana.
He kiʻekiʻe ke kumukūʻai o ke kaʻina hana electroplating, pono ke kūʻai ʻana i nā lako, nā mea maka a me nā lako mālama, ʻoiai ʻo nano-plating wale nō ka mea e pono ai nā nano-materials a me nā solvents kemika, a he haʻahaʻa ke kumukūʻai.
He maikaʻi ke ʻano like o ke kiʻiʻoniʻoni electroplated, ka hoʻopili ʻana, ka ʻōlinolino a me nā waiwai ʻē aʻe, akā ua kaupalena ʻia ka mānoanoa o ke kiʻiʻoniʻoni electroplated, no laila he paʻakikī ke kiʻi i kahi kiʻiʻoniʻoni mānoanoa kiʻekiʻe. Ma ka ʻaoʻao ʻē aʻe, hiki ke loaʻa ka kiʻiʻoniʻoni nano-mea me ka mānoanoa kiʻekiʻe e ka nanometer plating, a hiki ke hoʻomalu ʻia ka maʻalahi, ke kū'ē i ka corrosion a me ka conductivity uila o ke kiʻiʻoniʻoni.
Hoʻohana nui ʻia ka electroplating no ka hoʻomākaukau ʻana i ka ʻili metala, ka ʻili alloy a me ka ʻili kemika, hoʻohana nui ʻia i ka mālama ʻili o nā ʻāpana kaʻa, nā mea uila a me nā huahana ʻē aʻe. Hiki ke hoʻohana ʻia ka Nano-plating i ka mālama ʻili maze, ka hoʻomākaukau ʻana i ka uhi anti-corrosion, ka uhi anti-fingerprint a me nā kahua ʻē aʻe.
ʻO Electroplating a me nano-plating ʻelua mau ʻano hana mālama ʻili like ʻole, loaʻa i ka electroplating nā pono i ke kumukūʻai a me ka laulā o ka noi, ʻoiai hiki i ka nano-plating ke loaʻa ka mānoanoa kiʻekiʻe, ka maʻalahi maikaʻi, ke kūpaʻa ikaika i ka corrosion a me ka kaohi ikaika, a he ākea nā noi.
Ka manawa hoʻouna: Iune-14-2024
